MIS Laser Decaper
雷射開蓋機蓋機

Characteristic:

• Automatic laser decapsulation system
• All types of semiconductor package can be removed
• Any material(Cu, Au, Al) of wire part and 2nd bonding area can be opened
• Minimize the damage on Cu wire by chemical etching after laser operation 
• Die surface can be opened with chemical etching(by manual or MIS Wet Etch : Minimal acid use)
• Easy, simple, fast and safe operation
- Vision camera provide real time image
- User can set the laser decap area by mouse drag / numerical value input
- Superimposing X-ray image on captured sample picture is available
- Auto door lock : System door is not opened during operation
- Z axis adjustment available by PC program 
• User can observe the operation process through the window(protected from laser radiation)
• Repetitions made simple using recipe files
• Decap depth value measure & display available (Newly added function !)

 

 


  • SPECIFICATIONS

    Item Description
    Laser ND YVO4 1064nm
    Guide Laser 632nm Laser Class 2 (Red Beam)
    Dimension 850(W) x 600(D) x 1450(H) mm
    Weight Approx. 150 kg
    Handling IC Size 2x2 mm ~ 100x100 mm
    Vision Camera Color
    Utility Roted Voltage : AC 220V, 1 Phase
    Roted Current : 15A, Roted Frequency : 50 ~ 60 Hz
    Program User Interface : Window Based Graphical User Interface
    X-ray image data import available (Superimposition)
    Option Fume & Dust Collector