Optosurf 600

Fan-out panel grinding

Measuring roughenss and warpage on 600 x 600 mm²








  • 獨特的特性

    In the semiconductor industry, new backend production technologies are constantly being introduced in order to reduce the costs of wiring chips.

    One current technology is the usage of big panels on which single chips are bonded for the fan-out process.

    Depending on the process the surface, which may measure up to 600*600mm2, is finely ground. Both roughness and warpage are important here.

    To measure both these characteristics OptoSurf has developed on OptoScan 600 measurement device. With this machine single profiles and also full surface scans can be performed.

  • 600mm*600mm full panel scan.